Boca Raton, Florida - April 18, 2007
JARO Thermal, announces a powerful new series of light-weight, open-fin, low-profile IC coolers. The new coolers are efficiently-sized and pack an amazing level of thermal performance. The V6X090 model measures in at a compact 70Wx58Lx12H mm, making them ideal for companies that manufacture low-profile equipment. JARO’s unique embedded 'fan to sink' design reduces IC installation steps, while saving time and space. This makes them ideal for limited-space requirements such as PCMCIA, PCI express cards; blade servers; and all HOT CHIP SETS.

JARO’s V6X090 cooler has an ultra- low operating 'noise to CFM' ratio and is excellent at cooling BGA, graphic and embedded processors and other IC packages; that include microprocessors, FPGA’s, DSP’s. The unique open-finned design combines both natural and forced air convection while utilizing a pre-applied phase change pad and universal mounts. With a life expectancy of 50,000 hours, this breezy model is simply the best 'cooling value’ in its cooling class. Specifications for the new coolers can be downloaded at www.jarothermal.com. For further information on the V6X090 cooler or any of JARO’s other advanced thermal products, please contact Dennis Eisen at 561-241-6700 xt. 307 or d.eisen@jarothermal.com

AD0512HB-G70-S8Y43 VGX090